TY - GEN
T1 - Shear property of Pb-free solder joint according to temperature condition by SP and FEM
AU - Lee, Gyun
AU - Yu, Hyosun
AU - Yang, Sungmo
AU - Kang, Heeyong
AU - Hong, Dongpyo
AU - Song, Joonhyuk
PY - 2012
Y1 - 2012
N2 - The use of Pb-free solder alloys are just newly developed materials and their properties are not well established and documented yet. So, the research to substitute the critical problem of the Pb solder alloy are increasing widely. To evaluate the shear property of solder joints according to temperature condition was predicted through the Shear-Punch test and FEM. By using the database according to this, the reliability evaluation technology of the solder joints tries to be formulated. In this paper, the solder used the Sn37Pb, Sn-4Ag and the Sn4Ag0.5Cu. When solder melted in the copper interface, the solder joints according to reflow times, each modeling required for the Shear-Punch was made in consideration of the IMC layer thickness. And the micro shear punch test was performed to obtain material properties of solder according to temperature condition. The shear properties of specimen which was modeled was predicted through FEM. It compared with the test value in which it obtains from Shear-Punch. Also, a method which can obtain shear properties of Pb-free solder joints easily and quickly using FEM was proposed.
AB - The use of Pb-free solder alloys are just newly developed materials and their properties are not well established and documented yet. So, the research to substitute the critical problem of the Pb solder alloy are increasing widely. To evaluate the shear property of solder joints according to temperature condition was predicted through the Shear-Punch test and FEM. By using the database according to this, the reliability evaluation technology of the solder joints tries to be formulated. In this paper, the solder used the Sn37Pb, Sn-4Ag and the Sn4Ag0.5Cu. When solder melted in the copper interface, the solder joints according to reflow times, each modeling required for the Shear-Punch was made in consideration of the IMC layer thickness. And the micro shear punch test was performed to obtain material properties of solder according to temperature condition. The shear properties of specimen which was modeled was predicted through FEM. It compared with the test value in which it obtains from Shear-Punch. Also, a method which can obtain shear properties of Pb-free solder joints easily and quickly using FEM was proposed.
KW - FEM
KW - Intermetallic compound
KW - Pb-free solder
KW - Shear-Punch Test(SPTest)
KW - Solder joint
UR - https://www.scopus.com/pages/publications/84867278630
U2 - 10.4028/www.scientific.net/AMR.560-561.694
DO - 10.4028/www.scientific.net/AMR.560-561.694
M3 - Conference paper
AN - SCOPUS:84867278630
SN - 9783037854600
T3 - Advanced Materials Research
SP - 694
EP - 697
BT - Material Sciences and Technology
T2 - 2012 Spring International Conference on Material Sciences and Technology, MST-S
Y2 - 27 May 2012 through 30 May 2012
ER -