Silicon-on-quartz bonding based SPR chip

Yeonsu Lee; Sung min Sim; Eduardo Fontana; Ignacio Llamas-Garro; Gustavo Oliveira Cavalcanti; Jung Mu Kim

doi:10.1007/s00542-016-2960-x

Silicon-on-quartz bonding based SPR chip

Yeonsu Lee
, Sung min Sim
, Eduardo Fontana^*
, Ignacio Llamas-Garro
, Gustavo Oliveira Cavalcanti
, Jung Mu Kim

^*Corresponding author for this work

Division of Electronic Engineering

Research output: Contribution to journal › Journal article › peer-review

6 Scopus citations

Abstract

In this paper, an Otto coupling configuration based SPR chip is designed, simulated and fabricated using a silicon-on-quartz (SoQ) bonding process. The simulation of the SPR effect is conducted using COMSOL Multiphysics simulator (Altsoft Co.) using the designed chip dimensions, the optical constants are interpolated from data available in the literature. The size of the fabricated SPR chip is 30×30×1mm3. Resonance angle and reflectance are measured to be 42.19° and 0.411°, respectively, using an automated reflectometer. Discrepancy between measurement and simulation results is discussed by optical constant of the gold layer used as a thin metal film. The SoQ bonding process is a feasible approach for implementation of Otto coupling configuration based SPR chips.

Original language	English
Pages (from-to)	1983-1989
Number of pages	7
Journal	Microsystem Technologies
Volume	23
Issue number	6
DOIs	https://doi.org/10.1007/s00542-016-2960-x
State	Published - 2017.06.1

Quacquarelli Symonds(QS) Subject Topics

Materials Science
Computer Science & Information Systems
Engineering - Electrical & Electronic
Engineering - Petroleum
Physics & Astronomy

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10.1007/s00542-016-2960-x

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@article{26e45c56fb56401ca2fef9f4e53403ff,

title = "Silicon-on-quartz bonding based SPR chip",

abstract = "In this paper, an Otto coupling configuration based SPR chip is designed, simulated and fabricated using a silicon-on-quartz (SoQ) bonding process. The simulation of the SPR effect is conducted using COMSOL Multiphysics simulator (Altsoft Co.) using the designed chip dimensions, the optical constants are interpolated from data available in the literature. The size of the fabricated SPR chip is 30×30×1mm3. Resonance angle and reflectance are measured to be 42.19° and 0.411°, respectively, using an automated reflectometer. Discrepancy between measurement and simulation results is discussed by optical constant of the gold layer used as a thin metal film. The SoQ bonding process is a feasible approach for implementation of Otto coupling configuration based SPR chips.",

author = "Yeonsu Lee and Sim, \{Sung min\} and Eduardo Fontana and Ignacio Llamas-Garro and Cavalcanti, \{Gustavo Oliveira\} and Kim, \{Jung Mu\}",

note = "Publisher Copyright: {\textcopyright} 2016, Springer-Verlag Berlin Heidelberg.",

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doi = "10.1007/s00542-016-2960-x",

language = "English",

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TY - JOUR

T1 - Silicon-on-quartz bonding based SPR chip

AU - Lee, Yeonsu

AU - Sim, Sung min

AU - Fontana, Eduardo

AU - Llamas-Garro, Ignacio

AU - Cavalcanti, Gustavo Oliveira

AU - Kim, Jung Mu

PY - 2017/6/1

Y1 - 2017/6/1

N2 - In this paper, an Otto coupling configuration based SPR chip is designed, simulated and fabricated using a silicon-on-quartz (SoQ) bonding process. The simulation of the SPR effect is conducted using COMSOL Multiphysics simulator (Altsoft Co.) using the designed chip dimensions, the optical constants are interpolated from data available in the literature. The size of the fabricated SPR chip is 30×30×1mm3. Resonance angle and reflectance are measured to be 42.19° and 0.411°, respectively, using an automated reflectometer. Discrepancy between measurement and simulation results is discussed by optical constant of the gold layer used as a thin metal film. The SoQ bonding process is a feasible approach for implementation of Otto coupling configuration based SPR chips.

AB - In this paper, an Otto coupling configuration based SPR chip is designed, simulated and fabricated using a silicon-on-quartz (SoQ) bonding process. The simulation of the SPR effect is conducted using COMSOL Multiphysics simulator (Altsoft Co.) using the designed chip dimensions, the optical constants are interpolated from data available in the literature. The size of the fabricated SPR chip is 30×30×1mm3. Resonance angle and reflectance are measured to be 42.19° and 0.411°, respectively, using an automated reflectometer. Discrepancy between measurement and simulation results is discussed by optical constant of the gold layer used as a thin metal film. The SoQ bonding process is a feasible approach for implementation of Otto coupling configuration based SPR chips.

UR - https://www.scopus.com/pages/publications/84966570181

U2 - 10.1007/s00542-016-2960-x

DO - 10.1007/s00542-016-2960-x

M3 - Journal article

AN - SCOPUS:84966570181

SN - 0946-7076

VL - 23

SP - 1983

EP - 1989

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 6

ER -

Silicon-on-quartz bonding based SPR chip

Abstract

Quacquarelli Symonds(QS) Subject Topics

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