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Structural and electrical characteristics of chemical vapor deposited W/n-Si0.83Ge0.17/Si(001) and chemical vapor deposited WSix/n-Si0.83Ge0.17/Si(001)

  • Y. C. Jang
  • , D. O. Shin
  • , K. S. Kim
  • , K. H. Shim
  • , N. E. Lee*
  • , S. P. Youn
  • , K. J. Roh
  • , Y. H. Roh
  • *Corresponding author for this work
  • Sungkyunkwan University
  • Electronics and Telecommunications Research Institute

Research output: Contribution to journalJournal articlepeer-review

Abstract

The structural and electrical properties of chemical vapor deposited (CVD) semiconducting silicon compounds were studied by structural, chemical and electrical characterizations using X ray diffraction analysis (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), rutherford backscattering spectroscopy (RBS) and Auger electron spectroscopy (AES). The interfaces obtained showed the no penetration of tungsten into the silicon alloy layers due to the silicon and germanium reduction reactions at the initial stage of tungsten film growth. The electrical properties of Schottky diodes made out of the alloy was characterized by current-voltage measurements.

Original languageEnglish
Pages (from-to)1046-1051
Number of pages6
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume19
Issue number4
DOIs
StatePublished - 2001.07

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