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Structural and electrical properties of high pressure hydrogen post-annealed Pt-Er alloy metal gate on HfO2 film

  • Chel Jong Choi*
  • , Moon Gyu Jang
  • , Yark Yeon Kim
  • , Myung Sim Jeon
  • , Seong Jae Lee
  • , Hyun Doek Yang
  • , Ran Ju Jung
  • , Man Chang
  • , Hyun Sang Hwang
  • *Corresponding author for this work
  • Electronics and Telecommunications Research Institute
  • Samsung
  • Gwangju Institute of Science and Technology

Research output: Contribution to conferenceConference paperpeer-review

Abstract

We have investigated electrical and structural properties of high-pressure hydrogen postannealed (HPHA) Pt-Er alloy metal gate on HfO2 film. It is shown that the HPHA process causes the removal of micro-voids formed near interface between Pt-Er alloy and HfO2 films, resulting in the increase of gate electrode contact areas. It is further shown that the HPHA process plays a role in the reduction of PtOx and the interface trap density, leading to the negative shift of flat-band voltage and the improvement of the HfO2 interface quality, respectively. By considering the presence of an interfacial layer (IL) between the HfO2 film and a Si substrate and a negative charge at the HfO2/IL interface, the effective metal work function (Φm,eff) values of the Pt-Er alloy metal gate before and after HPHA are calculated to be ∼ 4.6 and ∼ 4.8 eV, respectively.

Original languageEnglish
Title of host publicationECS Transactions - International Symposium on Advanced Gate Stack, Source/Drain and Channel Engineering for Si-based CMOS
Subtitle of host publicationNew Materials, Processes and Equipment, 3
PublisherElectrochemical Society Inc.
Pages295-301
Number of pages7
Edition1
ISBN (Electronic)9781566775502
ISBN (Print)9781566775502
DOIs
StatePublished - 2007
EventInternational Symposium on Advanced Gate Stack, Source/Drain and Channel Engineering for Si-based CMOS: New Materials, Processes and Equipment, 3 - 211th ECS Meeting - Chicago, IL, United States
Duration: 2007.05.62007.05.10

Publication series

NameECS Transactions
Number1
Volume6
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceInternational Symposium on Advanced Gate Stack, Source/Drain and Channel Engineering for Si-based CMOS: New Materials, Processes and Equipment, 3 - 211th ECS Meeting
Country/TerritoryUnited States
CityChicago, IL
Period07.05.607.05.10

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