Abstract
The electrical and structural properties of molybdenum (Mo) Schottky contact to n-type GaN (4.07 × 10 18 cm -3) have been investigated before and after annealing at 600 °C. Measurements show that the Schottky barrier height of the as-deposited sample was 0.81 eV (I-V) and 1.02 eV (C-V), respectively. It is shown that when the sample is annealed at 400 °C the Schottky barrier height slightly decreases to 0.74 eV (I- V) and 0.92 eV (C- V), respectively. However, the barrier height degraded to 0.56 and 0.73 eV when the sample was annealed at 600 °C for 1 min in nitrogen ambient. Based on the Auger electron microscopy and X-ray diffraction results, the formation of nitride phases at the Mo/n-GaN interface could be the reason for degradation of Schottky barrier height upon annealing at 600 °C.
| Original language | English |
|---|---|
| Pages (from-to) | 622-627 |
| Number of pages | 6 |
| Journal | Physica Status Solidi (A) Applications and Materials Science |
| Volume | 203 |
| Issue number | 3 |
| DOIs | |
| State | Published - 2006.02 |
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