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Tailoring the internal structure of porous copper film via size-controlled copper nanosheets for electromagnetic interference shielding

  • Jeonbuk National University
  • Korea Institute of Science and Technology
  • Pusan National University
  • Chonnam National University
  • Korean Agency for Defense Development

Research output: Contribution to journalJournal articlepeer-review

Abstract

We studied the effects that internal porous structures tailored using size-controlled copper nanosheets (Cu NSs) had on the electromagnetic interference (EMI) shielding performance of the resulting Cu NS films. Cu NSs were carefully synthesized as two-dimensional (2D) conductive fillers, and their size was controlled by adjusting the concentrations of the shape modifier (iodine), stabilizer (hexadecylamine) and reductant (glucose). Three kinds of Cu NSs had the size of 3.8 μm (Max. 10.0 μm), 8.9 μm (Max. 28.0 μm), and 12.2 μm (Max. 33.7 μm) and used as a conductive filler for shielding film by spray printing. The films had different surface coverages, film thicknesses, and EMI shielding effectiveness (SE) at a fixed loading weight of 0.6 mg/cm2. The smallest to largest Cu NSs exhibited EMI shielding performances of 6.3 dB, 43.6 dB, and 69.7 dB, respectively, so performance was directly proportional to size.

Original languageEnglish
Article number115611
JournalMaterials Science and Engineering: B
Volume278
DOIs
StatePublished - 2022.04

Keywords

  • Copper nanosheet
  • Electromagnetic shielding
  • Metal nanosheet
  • Porous structure
  • Two-dimensional materials

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science
  • Engineering - Mechanical
  • Physics & Astronomy

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