Abstract
The dielectric properties and bias temperature instability characteristics of in situ nitrogen incorporated ZrOx Ny gate dielectrics were compared with those of ZrO2, HfO2, and HfO x Ny. ZrOx Ny showed a much smaller capacitance equivalent oxide thickness (1.43 nm) than ZrO2 (2.13 nm) and exhibited a turn-around effect under a positive gate stress bias in n-type metal oxide semiconductor field-effect transistor, which is consistent with HfOx Ny. However, compared to HfOx N y, ZrOx Ny showed a significantly lower initial Vth shift under a positive gate stress bias due to the lower number of shallow bulk traps related to oxygen vacancies.
| Original language | English |
|---|---|
| Pages (from-to) | G71-G74 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 13 |
| Issue number | 9 |
| DOIs | |
| State | Published - 2010 |
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