Skip to main navigation Skip to search Skip to main content

The bias temperature instability characteristics of in situ nitrogen incorporated ZrOx Ny Gate Dielectrics

  • Hyung Suk Jung*
  • , Jung Min Park
  • , Hyo Kyeom Kim
  • , Jeong Hwan Kim
  • , Seok Jun Won
  • , Joohwi Lee
  • , Sang Young Lee
  • , Cheol Seong Hwang
  • , Weon Hong Kim
  • , Min Woo Song
  • , Nae In Lee
  • , Deok Yong Cho
  • *Corresponding author for this work
  • Seoul National University
  • Samsung

Research output: Contribution to journalJournal articlepeer-review

Abstract

The dielectric properties and bias temperature instability characteristics of in situ nitrogen incorporated ZrOx Ny gate dielectrics were compared with those of ZrO2, HfO2, and HfO x Ny. ZrOx Ny showed a much smaller capacitance equivalent oxide thickness (1.43 nm) than ZrO2 (2.13 nm) and exhibited a turn-around effect under a positive gate stress bias in n-type metal oxide semiconductor field-effect transistor, which is consistent with HfOx Ny. However, compared to HfOx N y, ZrOx Ny showed a significantly lower initial Vth shift under a positive gate stress bias due to the lower number of shallow bulk traps related to oxygen vacancies.

Original languageEnglish
Pages (from-to)G71-G74
JournalElectrochemical and Solid-State Letters
Volume13
Issue number9
DOIs
StatePublished - 2010

Fingerprint

Dive into the research topics of 'The bias temperature instability characteristics of in situ nitrogen incorporated ZrOx Ny Gate Dielectrics'. Together they form a unique fingerprint.

Cite this