The effect of anodic oxidation condition of titanium substrate on the surface morphology and crystal structure of electrodeposited copper

Recently, requirement for the ultra thin copper foil increase with smaller and miniaturized electronic components. A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the surface morphology and crystal structure of copper. The oxide films were made current step and potential step at 20°C in 1.5 M sulfuric acid on pure titanium metal. The formation of a microporous oxide layer enhances the surface morphology of copper foil. When a copper foil was electroplated on the polished titanium surface, large particles were existed on the surface of the copper film deposited. However, a smooth surface was obtained when the 130 V anodized surface was used. The minimum value of surface roughness(Ra) was 0.254 μm.