Abstract
Recently, requirement for the ultra thin copper foil increase with smaller and miniaturized electronic components. A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the nucleation and growth of copper. The oxide films were made current step and potential step at 30°C in 1.5M sulfuric acid on pure titanium metal. The formation of a microporous oxide layer on the titanium electrode greatly enhances the surface density of copper crystals. For a 50seconds of deposition, the surface roughness of the copper deposit is lower than that of the untreated surface.
| Original language | English |
|---|---|
| Pages (from-to) | 128-134 |
| Number of pages | 7 |
| Journal | Journal of Korean Institute of Metals and Materials |
| Volume | 45 |
| Issue number | 2 |
| State | Published - 2007.02 |
Keywords
- Anodizing
- Copper foil
- Crystal growth
- Electrodeposition
Quacquarelli Symonds(QS) Subject Topics
- Materials Science
- Mathematics
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