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The effects of postdeposition annealing on the crystallization and electrical characteristics of HfO2 and ZrO2 gate dielectrics

  • Hyung Suk Jung*
  • , Jae Hyuck Jang
  • , Deok Yong Cho
  • , Sang Ho Jeon
  • , Hyo Kyeom Kim
  • , Sang Young Lee
  • , Cheol Seong Hwang
  • *Corresponding author for this work
  • Seoul National University

Research output: Contribution to journalJournal articlepeer-review

Abstract

This study examined the effects of postdeposition annealing (PDA) on the electrical characteristics of atomic layer deposited ZrO2 and HfO2 films using similar precursors and process conditions. After PDA at 600°C, the insulating properties of ZrO2 improved but those of HfO2 deteriorated. The improved insulating properties of ZrO 2 were attributed to the negligible increase in the interfacial layer thickness and an amorphous to tetragonal phase transformation. In addition, the degraded insulating properties of HfO2 after PDA at high temperatures were attributed to an abrupt increase in the interfacial layer thickness and the generation of conducting paths through the grain boundaries.

Original languageEnglish
Pages (from-to)G17-G19
JournalElectrochemical and Solid-State Letters
Volume14
Issue number5
DOIs
StatePublished - 2011

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