The influence of additives on the mechanical properties of electrodeposited copper Foils

Tae Gyu Woo; Il Song Park; Kwang Hee Jung; Kyu Song Son; Ram Song; Man Hyung Lee; Young Kyu Hwang; Kyeong Won Seol

doi:10.3365/K:JMM.2012.50.3.237

The influence of additives on the mechanical properties of electrodeposited copper Foils

Tae Gyu Woo
, Il Song Park
, Kwang Hee Jung
, Kyu Song Son
, Ram Song
, Man Hyung Lee
, Young Kyu Hwang
, Kyeong Won Seol^*

^*Corresponding author for this work

Jeonbuk National University
Calix Electronic chemical Co., Ltd.

Research output: Contribution to journal › Journal article › peer-review

6 Scopus citations

Abstract

The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and CI ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the CI ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only CI ions, whose values were 21.9% and 3.11 μΩ;Q-cm, respectively.

Original language	English
Pages (from-to)	237-242
Number of pages	6
Journal	Journal of Korean Institute of Metals and Materials
Volume	50
Issue number	3
DOIs	https://doi.org/10.3365/K:JMM.2012.50.3.237
State	Published - 2012.03

Keywords

Additive
Copper foil
Electrodeposite
Elongation
Surface morphology

Quacquarelli Symonds(QS) Subject Topics

Materials Science
Mathematics

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10.3365/K:JMM.2012.50.3.237

Cite this

@article{c116869c86174033896495cea3cd2947,

title = "The influence of additives on the mechanical properties of electrodeposited copper Foils",

abstract = "The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and CI ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the CI ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only CI ions, whose values were 21.9\% and 3.11 μΩ;Q-cm, respectively.",

keywords = "Additive, Copper foil, Electrodeposite, Elongation, Surface morphology",

author = "Woo, \{Tae Gyu\} and Park, \{Il Song\} and Jung, \{Kwang Hee\} and Son, \{Kyu Song\} and Ram Song and Lee, \{Man Hyung\} and Hwang, \{Young Kyu\} and Seol, \{Kyeong Won\}",

year = "2012",

month = mar,

doi = "10.3365/K:JMM.2012.50.3.237",

language = "English",

volume = "50",

pages = "237--242",

journal = "Journal of Korean Institute of Metals and Materials",

issn = "1738-8228",

number = "3",

}

TY - JOUR

T1 - The influence of additives on the mechanical properties of electrodeposited copper Foils

AU - Woo, Tae Gyu

AU - Park, Il Song

AU - Jung, Kwang Hee

AU - Son, Kyu Song

AU - Song, Ram

AU - Lee, Man Hyung

AU - Hwang, Young Kyu

AU - Seol, Kyeong Won

PY - 2012/3

Y1 - 2012/3

N2 - The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and CI ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the CI ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only CI ions, whose values were 21.9% and 3.11 μΩ;Q-cm, respectively.

AB - The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and CI ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the CI ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only CI ions, whose values were 21.9% and 3.11 μΩ;Q-cm, respectively.

KW - Additive

KW - Copper foil

KW - Electrodeposite

KW - Elongation

KW - Surface morphology

UR - https://www.scopus.com/pages/publications/84860170756

U2 - 10.3365/K:JMM.2012.50.3.237

DO - 10.3365/K:JMM.2012.50.3.237

M3 - Journal article

AN - SCOPUS:84860170756

SN - 1738-8228

VL - 50

SP - 237

EP - 242

JO - Journal of Korean Institute of Metals and Materials

JF - Journal of Korean Institute of Metals and Materials

IS - 3

ER -

The influence of additives on the mechanical properties of electrodeposited copper Foils

Abstract

Keywords

Quacquarelli Symonds(QS) Subject Topics

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