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The utilization of microencapsulated phase change material wallboards for energy saving

  • See Hoon Lee
  • , Sang Jun Yoon
  • , Young Gu Kim
  • , Jae Goo Lee*
  • *Corresponding author for this work
  • Korea Institute of Energy Research

Research output: Contribution to journalJournal articlepeer-review

Abstract

Wallboards with micro encapsulated phase changing material (micro PCM) were used to investigate the performance and the energy saving characteristics as building materials in winter and summer climate conditions. The test house consisted of a boiler with under floor heating system, an air conditioner, micro PCM wallboard room and conventional wallboard room. The outer temperature of the rooms could be artificially controlled at the temperature range of -12 to 35 °C. Micro PCM content in wallboards was 0-4 kg/m2. The melting temperature and latent heat of Micro PCM are 23 °C and 211 J/g. Also, micro PCM shows stable mechanical strength under 500 psi. As micro PCM content increased, the temperature fluctuations decreased. In case of micro PCM wallboard, temperature profiles in the room show stable and comfortable ranges. The optimum amount of micro PCM in wallboard to maximize energy saving efficiency was around 3 kg/m2.

Original languageEnglish
Pages (from-to)2206-2210
Number of pages5
JournalKorean Journal of Chemical Engineering
Volume28
Issue number11
DOIs
StatePublished - 2011.11

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • Building Material
  • Latent Heat
  • PCM
  • Wallboard

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