Thermal characteristics of a laser diode integrated on a silica-terraced PLC platform

Duk Jun Kim; Young Tak Han; Yoon Jung Park; Sang Ho Park; Hee Kyung Sung

doi:10.4218/etrij.05.0205.0005

Thermal characteristics of a laser diode integrated on a silica-terraced PLC platform

Duk Jun Kim^*
, Young Tak Han
, Yoon Jung Park
, Sang Ho Park
, Hee Kyung Sung

^*Corresponding author for this work

Division of Chemical Engineering

Electronics and Telecommunications Research Institute

Research output: Contribution to journal › Journal article › peer-review

7 Scopus citations

Abstract

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit (PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

Original language	English
Pages (from-to)	337-340
Number of pages	4
Journal	ETRI Journal
Volume	27
Issue number	3
DOIs	https://doi.org/10.4218/etrij.05.0205.0005
State	Published - 2005.06

Keywords

Heat dissipation
Hybrid integration
Plc platform
Silica terrace

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10.4218/etrij.05.0205.0005

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@article{8ea0e71d926047fd979b7265dde8930a,

title = "Thermal characteristics of a laser diode integrated on a silica-terraced PLC platform",

abstract = "A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit (PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.",

keywords = "Heat dissipation, Hybrid integration, Plc platform, Silica terrace",

author = "Kim, \{Duk Jun\} and Han, \{Young Tak\} and Park, \{Yoon Jung\} and Park, \{Sang Ho\} and Sung, \{Hee Kyung\}",

year = "2005",

month = jun,

doi = "10.4218/etrij.05.0205.0005",

language = "English",

volume = "27",

pages = "337--340",

journal = "ETRI Journal",

issn = "1225-6463",

number = "3",

}

TY - JOUR

T1 - Thermal characteristics of a laser diode integrated on a silica-terraced PLC platform

AU - Kim, Duk Jun

AU - Han, Young Tak

AU - Park, Yoon Jung

AU - Park, Sang Ho

AU - Sung, Hee Kyung

PY - 2005/6

Y1 - 2005/6

N2 - A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit (PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

AB - A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit (PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

KW - Heat dissipation

KW - Hybrid integration

KW - Plc platform

KW - Silica terrace

UR - https://www.scopus.com/pages/publications/20544447131

U2 - 10.4218/etrij.05.0205.0005

DO - 10.4218/etrij.05.0205.0005

M3 - Journal article

AN - SCOPUS:20544447131

SN - 1225-6463

VL - 27

SP - 337

EP - 340

JO - ETRI Journal

JF - ETRI Journal

IS - 3

ER -

Thermal characteristics of a laser diode integrated on a silica-terraced PLC platform

Abstract

Keywords

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