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Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication

  • Jaesang Yu
  • , Ji Eun Cha
  • , Seong Yun Kim*
  • *Corresponding author for this work
  • Korea Institute of Science and Technology

Research output: Contribution to journalJournal articlepeer-review

Abstract

We proposed a solvent-free melting process for fabricating high-conductivity polymer composite films filled with highly dispersed GNP fillers. The excellent dispersion of GNP fillers in the composite films was observed using X-ray micro-computed tomography (micro-CT), a non-destructive three-dimensional (3D) analysis technique that helps to analyze the internal structures of composite films with precision. The excellent dispersion of GNP fillers also confirmed by the fact that experimentally determined electrical and thermal conductivity values of the composite films were well consistent with the theoretical calculations obtained with a Mori-Tanaka method. The composite films exhibited an electrical conductivity on the order of 101 S/m and the in-plane thermal conductivity of 7.1 W/m·K when they contained 20 wt% GNP fillers.

Original languageEnglish
Pages (from-to)171-177
Number of pages7
JournalComposites Part B: Engineering
Volume110
DOIs
StatePublished - 2017.02.1

Keywords

  • Compression moulding
  • Non-destructive testing
  • Polymer-matrix composites (PMCs)
  • Thermal properties

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