Three-dimensional integration technology for real time micro-vision system

H. Kurino; T. Matsumoto; K. H. Yu; N. Miyakawa; H. Itani; H. Tsukamoto; M. Koyanagi

Three-dimensional integration technology for real time micro-vision system

H. Kurino^*
, T. Matsumoto
, K. H. Yu
, N. Miyakawa
, H. Itani
, H. Tsukamoto
, M. Koyanagi

^*Corresponding author for this work

Department of Aerospace Engineering

Tohoku University

Research output: Contribution to journal › Conference article › peer-review

27 Scopus citations

Abstract

It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.

Original language	English
Pages (from-to)	203-212
Number of pages	10
Journal	Proceedings of the Annual IEEE International Conference on Innovative Systems in Silicon
State	Published - 1997
Event	Proceedings of the 1997 2nd Annual IEEE International Conference on Innovative Systems in Silicon - Austin, TX, USA Duration: 1997.10.8 → 1997.10.10

Cite this

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title = "Three-dimensional integration technology for real time micro-vision system",

abstract = "It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.",

author = "H. Kurino and T. Matsumoto and Yu, \{K. H.\} and N. Miyakawa and H. Itani and H. Tsukamoto and M. Koyanagi",

year = "1997",

language = "English",

pages = "203--212",

journal = "Proceedings of the Annual IEEE International Conference on Innovative Systems in Silicon",

issn = "1063-2204",

note = "Proceedings of the 1997 2nd Annual IEEE International Conference on Innovative Systems in Silicon ; Conference date: 08-10-1997 Through 10-10-1997",

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TY - JOUR

T1 - Three-dimensional integration technology for real time micro-vision system

AU - Kurino, H.

AU - Matsumoto, T.

AU - Yu, K. H.

AU - Miyakawa, N.

AU - Itani, H.

AU - Tsukamoto, H.

AU - Koyanagi, M.

PY - 1997

Y1 - 1997

N2 - It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.

AB - It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.

UR - https://www.scopus.com/pages/publications/0031334355

M3 - Conference article

AN - SCOPUS:0031334355

SN - 1063-2204

SP - 203

EP - 212

JO - Proceedings of the Annual IEEE International Conference on Innovative Systems in Silicon

JF - Proceedings of the Annual IEEE International Conference on Innovative Systems in Silicon

T2 - Proceedings of the 1997 2nd Annual IEEE International Conference on Innovative Systems in Silicon

Y2 - 8 October 1997 through 10 October 1997

ER -

Three-dimensional integration technology for real time micro-vision system

Abstract

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