Abstract
Thermoelectric modules based on silicon nanowires (Si-NWs) have recently attracted significant attention as they show an improved thermoelectric efficiency due to a decrease in thermal conductivity. Here, we adopt a top-down fabrication method to dramatically reduce the thermal conductivity of vertical Si-NWs. The thermal conductivity of a vertical Si-NW is significantly suppressed with an increasing surface roughness, decreasing diameter, and increasing doping concentration. This large suppression is caused by enhanced phonon scattering, which depends on the phonon wavelength. The boron- and phosphorus-doped rough Si-NWs with a diameter of 200 nm and surface roughness of 6.88 nm show the lowest thermal conductivity of 10.1 and 14.8 W·m -1 ·K -1 , respectively, which are 5.1- and 3.6-fold lower than that of a smooth intrinsic nanowire and 14.8- and 10.1-fold lower than that of bulk silicon. A thermoelectric module was fabricated using this doped rough Si-NW array, and its thermoelectric performance is compared with previously reported Si-NW modules. The fabricated module exhibits an excellent performance with an open circuit voltage of 216.8 mV·cm -2 and a maximum power of 3.74 μW·cm -2 under a temperature difference of 180 K, the highest reported for Si-NW thermoelectric modules.
| Original language | English |
|---|---|
| Pages (from-to) | 747-755 |
| Number of pages | 9 |
| Journal | Nano Letters |
| Volume | 19 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2019.02.13 |
Keywords
- phonon scattering
- surface roughness
- thermal conductivity
- thermoelectric module
- top-down technique
- Vertical silicon nanowire
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