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Vertical Silicon Nanowire Thermoelectric Modules with Enhanced Thermoelectric Properties

  • Seungho Lee
  • , Kihyun Kim*
  • , Deok Hong Kang
  • , M. Meyyappan
  • , Chang Ki Baek
  • *Corresponding author for this work
  • Pohang University of Science and Technology
  • Research Institute of Industrial Science & Technology, Pohang
  • NASA Ames Research Center

Research output: Contribution to journalJournal articlepeer-review

Abstract

Thermoelectric modules based on silicon nanowires (Si-NWs) have recently attracted significant attention as they show an improved thermoelectric efficiency due to a decrease in thermal conductivity. Here, we adopt a top-down fabrication method to dramatically reduce the thermal conductivity of vertical Si-NWs. The thermal conductivity of a vertical Si-NW is significantly suppressed with an increasing surface roughness, decreasing diameter, and increasing doping concentration. This large suppression is caused by enhanced phonon scattering, which depends on the phonon wavelength. The boron- and phosphorus-doped rough Si-NWs with a diameter of 200 nm and surface roughness of 6.88 nm show the lowest thermal conductivity of 10.1 and 14.8 W·m -1 ·K -1 , respectively, which are 5.1- and 3.6-fold lower than that of a smooth intrinsic nanowire and 14.8- and 10.1-fold lower than that of bulk silicon. A thermoelectric module was fabricated using this doped rough Si-NW array, and its thermoelectric performance is compared with previously reported Si-NW modules. The fabricated module exhibits an excellent performance with an open circuit voltage of 216.8 mV·cm -2 and a maximum power of 3.74 μW·cm -2 under a temperature difference of 180 K, the highest reported for Si-NW thermoelectric modules.

Original languageEnglish
Pages (from-to)747-755
Number of pages9
JournalNano Letters
Volume19
Issue number2
DOIs
StatePublished - 2019.02.13

Keywords

  • phonon scattering
  • surface roughness
  • thermal conductivity
  • thermoelectric module
  • top-down technique
  • Vertical silicon nanowire

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